Massenspeicher-Schnittstellen : 10 x SATA-600 (RAID), 4 x NVME port, 2 x M.2
USB-/FireWire-Anschlüsse : 4 x USB 3.2 Gen 1 + (1 x USB 3.2 Gen 2 + 2 x USB 3.2 Gen 1 + 2 x USB 2.0 über eine interne Stiftleiste)
Audio : HD Audio (8-Kanal)
LAN : 2 x 10 Gigabit Ethernet
Technische Daten
6 GB, DDR5, DIMM, SATA 6 GB/s, Audio, Gigabit-LAN, HD-Audio, Lan, USB 3.2, USB 3.0, USB 3.0, VGA, PCI-Express
Intel® LGA 4677
Formfaktor
E-ATX
Kabellänge
0 cm
Tastaturlayout
Deutsch, QWERTZ
UKCA
Ja
Beschreibung
4th Gen Intel® Xeon® Scalable processors, Dual Socket LGA-4677 (Socket E) , CPU TDP supports up to 350W TDPSupport CXLIntel® C741 ChipsetUp to 4 TB 3DS ECC RDIMM, DDR5-4800MT/s(1DPC) in 16 DIMM slotsBroadcom BCM57416 Dual ports 10G LAN2 SATA DOM ports2 M.24 NVMe ports PCIe 5.0 x4 via 2 MCIO connectorsHD Audio 7.18 SATA 3.0 ports(C741)1 USB 3.2 Gen 2, 8 USB3.2 Gen 1 and 1 USB 2.05 PCIe 5.0 x161 PCIe 5.0 x8Form Factor: EATXDimension: 12.1" x 13.1" (30,734 cm x 33,274 cm)
Massenspeicher-Schnittstellen : 10 x SATA-600 (RAID), 4 x NVME port, 2 x M.2
USB-/FireWire-Anschlüsse : 4 x USB 3.2 Gen 1 + (1 x USB 3.2 Gen 2 + 2 x USB 3.2 Gen 1 + 2 x USB 2.0 über eine interne Stiftleiste)
Audio : HD Audio (8-Kanal)
LAN : 2 x 10 Gigabit Ethernet
Beschreibung
4th Gen Intel® Xeon® Scalable processors, Dual Socket LGA-4677 (Socket E) , CPU TDP supports up to 350W TDPSupport CXLIntel® C741 ChipsetUp to 4 TB 3DS ECC RDIMM, DDR5-4800MT/s(1DPC) in 16 DIMM slotsBroadcom BCM57416 Dual ports 10G LAN2 SATA DOM ports2 M.24 NVMe ports PCIe 5.0 x4 via 2 MCIO connectorsHD Audio 7.18 SATA 3.0 ports(C741)1 USB 3.2 Gen 2, 8 USB3.2 Gen 1 and 1 USB 2.05 PCIe 5.0 x161 PCIe 5.0 x8Form Factor: EATXDimension: 12.1" x 13.1" (30,734 cm x 33,274 cm)